surge components, inc. 95 east jefryn blvd deer park, ny 11729 (631) 5951818 2 1.. feature 100 watts peak power per line(tp=8/20us) sc705l package up to four lines of protection monolithic structure working woltage: 5v low clamping voltage esd protection > 25kv low leakage current rohs compliant transient protection for data lines to iec 610004 2(esd) 15kv (air), 8kv (contact); iec 6100044 (eft) 40a (5/50ns) 2. application cellular phones mp3 players notebook pdas digital cameras cellular phones station 3. electrical characteristics per line@25 (unless otherwise specified) note 1 parameter symbol conditions min. typ. max. units reverse standoff voltage v rwm 5 v reverse breakdown voltage v br i t =1ma 6 v reverse leakage current i r v rwm =5v t =25 5 ua clamping voltage v c i pp =1a t p =8/20us 8.8 v clamping voltage v c i pp =10a t p =8/20us 10.0 v junction capacitance c j v r =0v f=1mhz 60 pf note 1: pin 1,3,4,5 to pin 2
surge components, inc. 95 east jefryn blvd deer park, ny 11729 (631) 5951818 3 4. absolute maximum rating @25 note 1 rating symbol value units peak pulse power(t p =8/20s) p pp 100 w forward voltage@ 1a, 8/20s v f 1.5 v operating temperature t j 55 to +150 storage temperature t stg 55 to +150 note 1: pin 1,3,4,5 to pin 2 5.typical characteristics
surge components, inc. 95 east jefryn blvd deer park, ny 11729 (631) 5951818 4
surge components, inc. 95 east jefryn blvd deer park, ny 11729 (631) 5951818 5
surge components, inc. 95 east jefryn blvd deer park, ny 11729 (631) 5951818 6 6. product dimension package outline dim milimeter inches min max min max a 1.90 2.15 0.075 0.085 b 1.15 1.35 0.045 0.053 c 0.80 1.00 0.031 0.039 d 0.15 0.30 0.006 0.012 e 0.65 bsc - 0.026 bsc - f 1.30 bsc - 0.051 bsc - g 0.80 1.10 0.031 0.043 j 0.08 0.25 0.003 0.010 k 1.90 2.15 0.075 0.085 l 0 0.10 0 0.004 m 0.26 0.46 0.010 0.018 mounting pad typical dim millimeter inches 1 0.50 0.020 2 1.30 0.051 3 0.65 0.026 4 1.72 0.068 5 0.60 0.024 6 1.11 0.044 7 2.33 0.092 notes tape & reel ordering nomenclature 1. surface mount product is taped and reeled in accordance with eia-481. 2. 7 inch reel C 3,000 pieces per 8mm tape.
surge components, inc. 95 east jefryn blvd deer park, ny 11729 (631) 5951818 7 7. packing information 8.application note the ses5vsc705 is tvs arrays designed to protect i/o o r data lines from the damaging effects of esd or eft. this product provides both unidirectional and bidirectional protection, with a surage capabi lity of 100 watts ppp line for an 8/20s wave shape and esd protection > 25kv. commonmode unidirectional configuration(figure 1) the ses5vsc705 provides up to 4 lines of protectio n in a commonmode unidirectional configuration as depicted in figure 1. circuit connectivity is as follows: line 1 is connected to pin1. line 2 is connected to pin3. line 3 is connected to pin4. line 4 is connected to pin5. pin2 is connected to ground. commonmode unidirectional configuration (figure 2) the ses5vsc705 provides up to 3 lines of protectio n in a commonmode bidirectional configuration reel dia tape width ao bo ko d e f w po p2 p imax 178mm(7) 8mm 2.250.10 2.340.10 1.220.10 1.500.10 1.750.10 3 .500.05 8.000.30 4.000.10 2.000.005 4.000.005 0.25
surge components, inc. 95 east jefryn blvd deer park, ny 11729 (631) 5951818 8 as depicted in figure 2. circuit connectivity is as follows: line 1 is connected to pin1. line 2 is connected to pin3. line 3 is connected to pin4. line 5 is connected to ground. pin2 is not connected. differentialmode bidirectional configuration (figu re 3) the ses5vsc705 provides up to 4 lines of protectio n in a differentialmode bidirectional configuratio n as depicted in figure 3. circuit connectivity is as follows: line 1 is connected to pin1. line 2 is connected to pin3. line 3 is connected to pin4. line 4 is connected to pin5. pin2 is not connected. circuit board layout and protection device placemen t: circuit board layout is critical for suppression of esd transients. the following guidelines are recommended: 1. place the protection devices as close to the inp ut terminal or connector as possible. 2. the path length between the protection device an d protected line should be minimized. 3. keep parallel signal pats to a minimum. 4. avoid running protection conductors in parallel with unprotected conductor. 5. minimize all printedcircuit board conductive lo ops including power and ground loops. 6. minimize the length of the transient return path to ground. 7. avoid using shared transient return paths to com mon ground point. 8. ground planes should be used whenever possible. for multilayer printedcircuit boards, use ground vias
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